KLS1-NGFF01-3.2-B-G1U

Kureba: 3.2mm
Rudzi:A,B,E,M
Goridhe Plating:G1U-Gold 1u”G3U-Gold 3u”G30U-Gold 30u”

1: Yakagadzirirwa ese ari maviri- uye maviri-mativi modules
2:Inowanikwa mune dzakasiyana siyana keying sarudzo dzemodule makadhi

3:Support PCI Express 3.0, USB 3.0, uye SATA 3.0

4: Sarudzo mukukwirira, chinzvimbo, dhizaini, uye keying sarudzo

5:Inowanikwa munzvimbo dzakasiyana siyana

Material Specification:

Dzimba: LCP+30% GF UL94 V-0.Black

Kubata: Copper Alloy (C5210) T = 0.12mm.

Gumbo: Copper Alloy (C2680) T=0.20mm.

Bata: ona P/N.

Gumbo: Matte Tin 50μ” min. zvakazara, Nickel 50μ” min. underplated.

Kupinza simba: 20N max.

Kubvisa simba: 20N max.

Kugara kwenguva refu: 60 kutenderera min.

Vibration: Hapana kupera kwemagetsi kunopfuura 1u sekondi. zvichaitika;

Mechanical shock: 285G hafu sine / 6 axis. hapana kupera kwemagetsi kunopfuura 1u yechipiri ichaitika;

Chiyero Chazvino: 0.5A (papini).

Voltage Rating: 50V AC (papini).

LLCR: Bata 55mΩ max.(yekutanga), 20mΩ max. shanduko inobvumirwa (yekupedzisira).

Insulation Resistance: 5,000MΩ min. pa500V DC.

Dielectric inomira voltage: 300V AC / 60s.

IR Reflow:

Tembiricha yepamusoro pabhodhi ichachengetwa kwemasekonzi gumi pa260±5°C.

Kushanda tembiricha siyana: -40 ° C ~ 85 ° C (pasina kurasikirwa basa).

Zvese zvikamu RoHS uye Reach zvinoenderana.