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SIM Card Connector,PUSH PUSH,6P+1P,H1.9mm,nePosvo Material: Dzimba:Hi-Temp Plastic,UL94V-0.Rated. Kubata: Copper Alloy. Shell: Copper Alloy/Simbi. Plating: Nzvimbo Yekubatana:Goridhe flash. Solder nzvimbo: 80u" Min, Matte tin alloy akaputirwa. Pasi peplate:30u" min,Nickel. Shell:30u" Min,Nickel yakazara yakazara Solder nzvimbo: Gole flash. Zvemagetsi: Chiyero chezvino: 0.5A Kutsigira Voltage: AC500V rms Insulation Resistance: 1000MΩMin, At DC 500V Bata Kupikisa: 100mΩ Max. Making Cycles:3000 Insertions. Kushanda Tembiricha: -40%%DC TO +85%%DC |
Chikamu Nha. | Tsanangudzo | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nguva | Order |