Order Information
KLS1-NGFF01-3.2-67-B-G0

Plating:1u"~30u"NdaramaG1U-Goridhe 1u"G3U-Goridhe 3u"G30U-Gold30u"

• 0.5mm pitch ine 67 nzvimbo
• Yakagadzirirwa ese ari maviri- uye maviri-sided modules
• Inowanikwa mune dzakasiyana siyana keying sarudzo dzemodule makadhi
• Tsigira PCI Express 3.0, USB 3.0, uye SATA 3.0
• Sarudzo muhurefu, chinzvimbo, dhizaini, uye keying sarudzo
• Inowanikwa munzvimbo dzakasiyana-siyana
  
• MMaterial Specification:
• Dzimba: LCP+30% GF UL94 V-0.
• Kubata: Copper Alloy (C5210) T = 0.12mm.
• Gumbo: Copper Alloy (C2680) T=0.20mm.
• Plating Specification:
• Bata: ona P/N.
• Gumbo: Matte Tin 50μ" min. yakazara, Nickel 50μ" min. underplated.
• Mechanical Performance:
• Kupinza simba: 20N max.
• Kubvisa simba: 20N max.
• Kugara kwenguva refu: 60 kutenderera min.
• Vibration: Hapana kupera kwemagetsi kunopfuura 1u sekondi. zvichaitika;
• Mechanical shock: 285G hafu sine / 6 axis. hapana kupera kwemagetsi kunodarika 1u sekondi kuchaitika;
• Kuita Kwemagetsi:
• Chiyero Chazvino: 0.5A (papini).
• Voltage Rating: 50V AC (papini).
• LLCR: Bata 55m? max.(yekutanga), 20m? max. shanduko inobvumirwa (yekupedzisira).
• Insulation Resistance: 5,000M? min. pa500V DC.
• Dielectric inomira voltage: 300V AC / 60s.
• IR Reflow:
  Tembiricha yepamusoro pabhodhi ichachengetwa kwemasekonzi gumi pa260±5°C.
  Kushanda tembiricha siyana: -40 ° C ~ 85 ° C (pasina kurasikirwa basa).
  Zvese zvikamu RoHS uye Reach zvinoenderana.