| 0.50mm Pitch M.2 NGFF Card Connector 67P Order Information
KLS1-NGFF01-3.2-67-B-G0
Urefu: 1.2mm 1.5mm 1.8mm 3.2mm 4.0mm 5.8mm 6.4mm
Ruvara: Dema Plating:1u"~30u"GoridheG1U-Goridhe 1u"G3U-Goridhe 3u"G30U-Gold30u"
- 0.5mm pitch ine 67 nzvimbo
- Yakagadzirirwa ese ari maviri- uye maviri-sided modules
- Inowanikwa mune dzakasiyana siyana keying sarudzo dzemodule makadhi
- Tsigira PCI Express 3.0, USB 3.0, uye SATA 3.0
- Sarudzo muhurefu, chinzvimbo, dhizaini, uye keying sarudzo
- Inowanikwa munzvimbo dzakasiyana-siyana
- MMaterial Specification:
- Dzimba: LCP+30% GF UL94 V-0.
- Kubata: Copper Alloy (C5210) T = 0.12mm.
- Gumbo: Copper Alloy (C2680) T=0.20mm.
- Plating Specification:
- Bata: ona P/N.
- Gumbo: Matte Tin 50μ" min. yakazara, Nickel 50μ" min.underplated.
- Mechanical Performance:
- Kupinza simba: 20N max.
- Kubvisa simba: 20N max.
- Kugara kwenguva refu: 60 kutenderera min.
- Vibration: Hapana kupera kwemagetsi kunopfuura 1u sekondi.zvichaitika;
- Mechanical shock: 285G hafu sine / 6 axis.hapana kupera kwemagetsi kunodarika 1u sekondi kuchaitika;
- Kuita Kwemagetsi:
- Chiyero Chazvino: 0.5A (papini).
- Voltage Rating: 50V AC (papini).
- LLCR: Bata 55m?max.(yekutanga), 20m?max.shanduko inobvumirwa (yekupedzisira).
- Insulation Resistance: 5,000M?min.pa500V DC.
- Dielectric inomira voltage: 300V AC / 60s.
- IR Reflow:
Tembiricha yepamusoro pabhodhi ichachengetwa kwemasekonzi gumi pa260±5°C. Kushanda tembiricha siyana: -40 ° C ~ 85 ° C (pasina kurasikirwa basa). Zvese zvikamu RoHS uye Reach zvinoenderana. |
