Micro SD Kadhi CONN; HINGED TYPE, H1.5mm & H1.8mm KLS1-TF-007
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| Micro SD Kadhi CONN; HINGED TYPE, H1.5mm & H1.8mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy.AU Plating pane yese terminal yekusangana nzvimbo, uye tin plating pane solder muswe nzvimbo. Shell:Stainless Simbi. Zvemagetsi: Chiyero chezvino: 0.5 A Voltage Rating: 5.0 vrms Insulation Resistance: 1000MΩ Min./500V DC Withstanding Voltage: 250V AC Kweminiti imwe. Bata Resistance:100mΩ Max.AT 10mA/20mV Max Kushanda Tembiricha: -45ºC ~+105ºC Mating Cycles:10000 Insertions. |
| Chikamu Nha. | Tsanangudzo | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nguva | Order |
