Micro SIM Card Connector 8P,PUSH DHOVA,H2.4mm KLS1-SIM-044-8P
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| Micro SIM Card Connector 8P, PUSH DHOVA, H2.4mm Material: Nheyo:Hi-Temp Thermoplastic,UL94V-0.Black. Data Kubata: Copper Alloy, Gold Plated. Shell:Stainless Simbi,Goridhe Yakaputirwa. Zvemagetsi: Bata Resistance: 50mΩ yakajairika, 100Ω Max. Insulation Resistance:> 1000MΩ/500V DC. 3.Solderability Chikamu chemhute:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Manual soldering:370ºC.3sec.Max. Kushanda Tembiricha: -45ºC ~+105ºC |
| Chikamu Nha. | Tsanangudzo | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nguva | Order |
