MICRO USB 3.0 PLUG,10P Solder KLS1-234-10M1
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| Material: Dzimba:Thermoplastic,UL94V-0 Kubata: Copper Alloy. Shell:SUS201. Plating: Bata:Goridhe Plating Ona Tafura AT Contact Area Tin Plating AT Solder Area. Nickel Under akaputirwa Kwese. Shell:Solder Nickel Yakaputirwa Pamusoro Pese. Zvemagetsi: Kushanda Tembiricha: -20°C TO +80°C. |
| Chikamu Nha. | Tsanangudzo | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nguva | Order |
