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Micro USB zvibatanidza

MICRO USB 3.0 Mukadzi,10P SMD KLS1-234-10F3

Ruzivo rwechigadzirwa Chinyorwa: Dzimba: LCP, UL94V-0 Kubata: Copper Alloy. Gold Plating AT Contact Area Tin Plating paMiswe. Shell:SUS304.Tin Plated Electrical: Contact Current Rating: 1.0A Max. Bata Kupikisa: 30m? Max. Insulation Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Kushanda Tembiricha:-30°C ~ +80°C. Mechanical Hunhu: Mating Force: 3.5kgf Max. Kusabatana Simba: 1.0kgf Min. Dura...

MICRO USB 3.0 Mukadzi,10P Vertical SMD KLS1-234-10F2

Ruzivo rwechigadzirwa Chinyorwa: Dzimba: LCP, UL94V-0 Kubata: Copper Alloy. Gold Plating AT Contact Area Tin Plating paMiswe. Shell:SUS304.Tin Plated Electrical: Contact Current Rating: 1.5A Max. Bata Kupikisa: 30m? Max. Insulation Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Kushanda Tembiricha: -20°C ~ +60°C. Mechanical Hunhu: Mating Force: 3.5kgf Max. Kusabatana Simba: 1.0kgf Min. Dura...

MICRO USB 3.0 Mukadzi,10P SMD KLS1-234-10F1

Ruzivo rwechigadzirwa Chinyorwa: Dzimba: LCP, UL94V-0 Kubata: Copper Alloy. Gold Plating AT Contact Area Tin Plating paMiswe. Shell:SUS304.Tin Plated Electrical: Contact Current Rating: 1.0A Max. Bata Kupikisa: 30m? Max. Insulation Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Kushanda Tembiricha:-30°C ~ +80°C. Mechanical Hunhu: Mating Force: 3.5kgf Max. Kusabatana Simba: 1.0kgf Min. Dura...

MICRO USB 3.0 PLUG,10P Solder KLS1-234-10M1

Ruzivo rwechigadzirwa Chinyorwa: Dzimba:Thermoplastic,UL94V-0 Kubata:Copper Alloy. Shell:SUS201. Kuputira: Bata:Goridhe Plating Ona Tafura AT Contact Area Tin Plating AT Solder Area. Nickel Under akaputirwa Kwese. Shell:Solder Nickel Yakaputirwa Pamusoro Pese. Magetsi: Tembiricha Yekushanda: -20°C TO +80°C. Chikamu Nha. Tsanangudzo PCS/CTN GW(KG) CMB(m3) OrderQty. Nguva Order

CONN PLUG MICRO USB TYPE B CLIP KLS1-236-5M8

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Temperature Thermoplastics, UL94V-0 LCP,Dema. Contact:C2680/C5191. Shell: Simbi. Pedzisa: Bata: Yakaputirwa Goridhe Munzvimbo yeMating; Tin Lead PaSolder Talls. Shell:Tin Lead Plating. Magetsi: Bata Resistance:30mΩ Max. Dielectric Withstanding Voltage: 50 V AC AT Sea Level. Insulation Resistance: 100MΩ Min. Chikamu Nha. Tsanangudzo PCS/CTN GW(KG) CMB(m3) OrderQty. Nguva Orde...

CONN PLUG MICRO USB TYPE B CLIP L8.8 KLS1-236-5M7

Ruzivo rwechigadzirwa Dzimba:Hing Tembiricha Thermoplastic ine gf,UL94V-0. Kubata: Copper Alloy,t=0.20mm. Shell:SUS,t=0.20mm. Magetsi: Chiyero Chazvino:1A Max. Dielectric Withstanding Voltage: 100 V AC ye1 min. Bata Kupikisa: 50mΩ Max. Insulation Resistance: 100MΩ Min. Yese Kubatana Simba: 3.57 kgf Max. Total Unmating Force:1.0 kgf Min. Tembiricha Range: -30°C Kusvikira +80°C Chikamu Nha. Tsanangudzo PCS/CTN GW..

CONN PLUG MICRO USB TYPE B CLIP L6.8 KLS1-236-5M6

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Tembiricha Thermoplastic ine gf,UL94V-0. Kubata: Copper Alloy,t=0.20mm. Shell:SUS,t=0.20mm. Magetsi: Chiyero Chazvino:1A Max. Dielectric Withstanding Voltage: 100 V AC ye1 min. Bata Kupikisa: 50mΩ Max. Insulation Resistance: 100MΩ Min. Yese Kubatana Simba: 3.57 kgf Max. Total Unmating Force:1.0 kgf Min. Tembiricha Range: -30 ° C Kusvikira + 80 ° C Chikamu Nha. Descripti...

CONN PLUG MICRO USB TYPE B SMD KLS1-236-5M3

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Temperature Thermoplastics, UL94V-0 LCP,Dema. Contact:C2680/C5191. Shell: Mhangura / simbi / Stainless simbi. Pedzisa: Bata: Yakaputirwa Goridhe Munzvimbo yeMating; Tin Lead PaSolder Talls. Shell:Tin Lead Plating. Magetsi: Bata Resistance:30mΩ Max. Dielectric Withstanding Voltage: 50 V AC AT Sea Level. Insulation Resistance: 100MΩ Min. Chikamu Nha. Tsanangudzo PCS/CTN GW(KG) CMB(m3) Ord...

CONN PLUG MICRO USB TYPE B SMD KLS1-236-5M2

Ruzivo rwechigadzirwa Chigadzirwa: Dzimba: Hing Temperature Plastiki, UL94V-0, Nhema. Contact:C2680/C5191. Shell:Mhangura. Pedzisa: Bata: Yakaputirwa Goridhe Munzvimbo yeMating; Tin Lead PaSolder Talls. Shell:Nickel Plating. Magetsi: Bata Resistance:30mΩ Max. Insulation Resistance: 100MΩ Min. Chikamu Nha. Tsanangudzo PCS/CTN GW(KG) CMB(m3) OrderQty. Nguva Order

CONN PLUG MICRO USB TYPE B PCB MID MOUNT KLS1-236-5M1

Ruzivo rwechigadzirwa Chishandiso Chimba: LCP, UL94V-0, Nhema. Kubata: Copper Alloy. Shell:SUS 304 T=0.20. Pedzisa: Bata:Goridhe Plating paBata nzvimbo. 80u" Sn Plating pane solder tail area. 50u" Min.Nickel Under plating pamusoro pezvose. Magetsi: Voltage Rating:30VAC RMS. Chiyero Chazvino:2.0A(pini 1 5); 1.0A(pini 2 3 4). Bata Kupikisa: 50mΩ Max. Insulation Resistance: 100MΩ Min. Dielectric Withstanding Voltage: 500 V AC Ye ...

CONN PLUG MICRO USB Solder KLS1-235-5

Ruzivo Rwechigadzirwa Chishandiso: Dzimba:LCP E130,UL94V-0 Black Kubata:Brass 5210. Shell:Stainless Simbi,T=0.20±0.03mm. Plating: Bata: Yakapfekwa Goridhe Flash Yenzvimbo Yekusangana. Shell:Nickel Pamusoro Pese (munyu pfapfaidzo ye24H). Shell:Goridhe Pamusoro pezvose (pfapfaidzo yemunyu ye24H). Magetsi: Tembiricha Yekushanda: -20°C TO +80°C. Chigadzirwa Chinoenderana nechikumbiro RoHS Chikamu Nha. Tsanangudzo PCS/CTN GW(KG) CMB(m3) OrderQty. Nguva Order

CONN PLUG MICRO USB TYPE B Solder KLS1-235-3

Ruzivo rwechigadzirwa Chinyorwa: Dzimba: LCP, UL94V-0 Nhema. Kubata:Phosphor Bronze,T=0.20±0.01mm. Mberi Shell:Stainless Simbi,T=0.20±0.01mm. Shure Shell:Stainless Simbi,T=0.20±0.01mm. Kubata:Simbi isina simbi,T=0.40±0.01mm. Inopedza: Mazita: Goridhe yakapenya, paBata nzvimbo. 100u-120u" Tin.Plating, pane solder miswe. 50u-80u" Nickel,Underplating pamusoro pezvose. Magetsi: Chiyero Chazvino:1A Max. Dielectric Withstanding Volta...

CONN PLUG MICRO USB TYPE B Solder T3.0,L8.8mm KLS1-235-2

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Temperature Thermoplastics, UL94V-0 LCP,Dema. Kubata: Copper Alloy C2680. Shell: Copper Alloy C2680/SPCC. Pedzisa: Bata: Yakaputirwa Goridhe Munzvimbo yeMating; Tin PaSolder Talls. Shell:Nickel Plating. Magetsi: Chiyero Chazvino: 1.5A/Contact Terminal. Voltage Rating:30V DC Bata Resistance:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Insulation Resistance: 1000MΩ Min. Conn...

CONN PLUG MICRO USB TYPE B Solder T3.0,L6.8mm KLS1-235-1

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Temperature Thermoplastics, UL94V-0 LCP,Dema. Kubata: Copper Alloy C2680. Shell: Copper Alloy C2680/SPCC. Pedzisa: Bata: Yakaputirwa Goridhe Munzvimbo yeMating; Tin PaSolder Talls. Shell:Nickel Plating. Magetsi: Chiyero Chazvino: 1.5A/Contact Terminal. Voltage Rating:30V DC Bata Resistance:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Insulation Resistance: 1000MΩ Min. Connecto...

CONN PLUG MICRO USB TYPE B solder T5.0 KLS1-235-0

Ruzivo Rwechigadzirwa Chinyorwa: Dzimba:LCP+30%GF Kupisa Kwekupisa Rating:UL 94V-0 Dema. Shell:Stainless Simbi. Contacts:Brass Contacts Plating Gold Standard:Flash. Magetsi: Yazvino Rating:0.5 Amp. Voltage: 100 V AC / DC Max. Dielectric Kumira: 500 V AC kweminiti imwe. Operating Temperature: -55°C~+85°C Chikamu Nha. Tsanangudzo PCS/CTN GW(KG) CMB(m3) OrderQty. Nguva Order

CONN MICRO USB 5P Solder mhando KLS1-4254

Ruzivo rwechigadzirwa Chigadzirwa: Dzimba: Yakakwira Temperature Plastiki, UL94V-0, Nhema. Bata A:Brass T=0.20mm,Au Plated. Shell:Stainless Simbi T=0.25mm,Ni Plated. Magetsi: 1.Current Current Rating: 1.0A(Signal PIN 2 3 4); 1.8A (Simba PIN 1 5) 2.Contact Resistance:40mΩ Max. 3.Insulation Resistance:100MΩ Min. 4.Dielectric Withstanding: 100V AC Min. 5.Durability:10000 cycles. 6.Connector Mating masimba:35N Max (3.57Kgf). 7.Co...

CONN MICRO USB 5P Clip mhando 1.0mm KLS1-4253

Chigadzirwa Ruzivo Ruzivo: Insulation Material Thermoplastic. Shell: Copper Alloy/SPCC,T = 0.30mm. Plating:Nickel. Terminal:Copper Alloy,T=0.25mm. Plating:Goridhe/Tin Yakaputirwa. Magetsi: Insulation Resistance:1000MΩ Min. Bata Kupikisa:30mΩ Max. Kutsigira Voltage: 500 V AC. Mechanical Hunhu: Simba rekuisa:3.5kgf Max. Simba Rekudhonza:1.02kgf Min. Chikamu Nha. Tsanangudzo PCS/CTN GW(KG) CMB(m3) OrderQty. Nguva Order

CONN MICRO USB 5P Clip mhando 0.8mm KLS1-4252

Ruzivo Rwechigadzirwa ZVINOTAURWA: 1.Yazvino Chiyero: 1.0A (Signal PIN 2 3 4); 1.8A (Simba PIN 1 5) 2.Contact Resistance:40mΩ Max. 3.Insulation Resistance:100MΩ Min. 4.Dielectric Withstanding: 100 V AC Min. 5.Durability:10000 cycles. 6.Connector Mating masimba:35N Max (3.57Kgf). 7.Connector Unmating simba:8N Min (0.30Kgf). 8.Chigadzirwa Sangana Chikumbiro cheRoHS Chikamu Nha. Tsanangudzo PCS/CTN GW(KG) CMB(m3) OrderQty. Ti...

CONN MICRO USB 2P DIP KLS1-4251

Ruzivo rwechigadzirwa Chishandiso Dzimba:Hing Tembiricha Thermoplastics,Dema. Kubata: Copper Alloy C1591. Shell: Copper Alloy C2680/SPCC. Pedzisa: Bata:Goridhe Yakaputirwa Munzvimbo yeMating;Tin Pamareba Solder. Shell:Nickel Plating. Magetsi: Chiyero Chazvino: 1.5A/Contact Terminal. Voltage Rating:30V DC Bata Resistance:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Insulation Resistance: 1000MΩ Min. Connector Mate uye Unmated Force Mate For...

CONN MICRO USB 2P R/A DIP KLS1-4250

Ruzivo rwechigadzirwa Chishandiso Dzimba:Hing Tembiricha Thermoplastics,Dema. Kubata: Copper Alloy C1591. Shell: Copper Alloy C2680/SPCC. Pedzisa: Bata:Goridhe Yakaputirwa Munzvimbo yeMating;Tin Pamareba Solder. Shell:Nickel Plating. Magetsi: Chiyero Chazvino: 1.5A/Contact Terminal. Voltage Rating:30V DC Bata Resistance:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Insulation Resistance: 1000MΩ Min. Connector Mate uye Unmated Force Mate For...

CONN RCPT 5POS MICRO USB DIP 7.2mm KLS1-4248

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Tembiricha Thermoplastic ine GF,UL94V-0,Nhema. Kubata: Copper Alloy,t=0.15mm. Shell: Copper Alloy,t = 0.30mm. Magetsi: Chiyero Chazvino:1A Max. Dielectric Withstanding Voltage: 100 V AC ye1 min. Bata Kupikisa: 50mΩ Max. Insulation Resistance: 100MΩ Min. Yese Kubatana Simba: 3.57 kgf Max. Total Unmating Force:1.0 kgf Min. Tembiricha Range: -30°C Kusvikira +80°C Chikamu Nha.

CONN RCPT 5POS MICRO USB DIP 7.2mm KLS1-4247

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Tembiricha Thermoplastic ine GF,UL94V-0,Black Kubata:Copper Alloy,t=0.20mm. Shell: Copper Alloy,t = 0.25mm. Magetsi: Chiyero Chazvino:1A Max. Dielectric Withstanding Voltage: 100 V AC ye1 min. Bata Kupikisa: 50mΩ Max. Insulation Resistance: 100MΩ Min. Yese Kubatana Simba: 3.57 kgf Max. Total Unmating Force:1.0 kgf Min. Tembiricha Range: -30°C Kusvikira +80°C Chikamu Nha.

CONN RCPT 5POS MICRO USB DIP 5.9mm KLS1-4245

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Temperature Thermoplastics, UL94V-0 LCP,Dema. Kubata: Copper Alloy C2680. Shell: Copper Alloy C2680. Pedzisa: Bata: Yakaputirwa Goridhe Munzvimbo yeMating; Tin PaSolder Talls. Shell:Nickel Plating. Magetsi: Chiyero Chazvino:1.0A/Contact Terminal. Voltage Rating:30V DC Bata Resistance:50mΩ Max. Dielectric Withstanding Voltage: 300 V AC AT Sea Level. Insulation Resistance: 100MΩ Min. Chokubatanidza...

CONN RCPT 5POS MICRO USB SMD KLS1-4244

Ruzivo rwechigadzirwa Chishandiso Chigadzirwa:Hing Temperature Thermoplastics, UL94V-0 LCP,Dema. Kubata: Copper Alloy C5191. Shell: Copper Alloy C2680. Pedzisa: Bata: Yakaputirwa Goridhe Munzvimbo yeMating; Tin PaSolder Talls. Shell:Nickel Plating. Magetsi: Chiyero Chazvino:1.0A/Contact Terminal. Voltage Rating:30V DC Bata Resistance:50mΩ Max. Dielectric Withstanding Voltage: 300 V AC AT Sea Level. Insulation Resistance: 100MΩ Min. Chibatanidza...
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