SIM Card Connector,PUSH PUSH,6P+2P,H1.85mm, pasina Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kubata: Copper Alloy,T=0.15mm;Shell:Stainless Simbi,T=0.15mm Finsh: Terminal:50u" min Nickel Yakaputirwa paAllover,Goridhe Plating paBata Arer,80u" min Tin pane Solder Muswe. Shell:50u"Nickel Yakaputirwa paAllover,Goridhe Flash paSolder Latch. Zvemagetsi: Chiyero chezvino: 0.5A Voltage Rating: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC Withstanding Voltage: 250V ACrms Kweminiti imwe. Bata Resistance:100M Max.At 10MA/20mV MAX. Kushanda Tembiricha: -45ºC ~+105ºC Mating Cycles:5000 Insertions. |