SIM Card Connector,PUSH PUSH,8P+1P,H1.85mm,pasina Post KLS1-SIM-074B
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| SIM Card Connector,PUSH PUSH,8P+1P,H1.85mm,pasina Post Material: Dzimba:Kupisa Kwepamusoro Thermoplastic,UL94V-0.Black. Kubata: Copper Alloy. Kavha: Bata: Copper Alloys Kana Simbi. Plating: Underplate:Nickel. Nzvimbo Yekusangana:Goridhe Pamusoro peNickel. Solder Nzvimbo: Tin Pamusoro peNickel. Shell:G/F Plate Pamusoro PeNickel PaMiswe YeSolder Zvemagetsi: Chiyero chezvino: 0.5A Voltage Rating: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC Withstanding Voltage: 250V ACrms Kweminiti imwe. Bata Resistance: 100M Max.At 10MA/20mVMAX. Kushanda Tembiricha: -45ºC ~+85ºC Mating Cycles:5000 Insertions. |
| Chikamu Nha. | Tsanangudzo | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Nguva | Order |
