SIM Card Connector,PUSH PUSH,8P+1P,H1.9mm,ine Post KLS1-SIM-108
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SIM Card Connector,PUSH PUSH,8P+1P,H1.9mm,nePosvo
Material:
Dzimba:Hi-Temp Plastic,UL94V-0.Rated.
Kubata: Copper Alloy.
Shell: Copper Alloy.
Plating:
Nzvimbo Yekubatana:Goridhe flash.
Solder nzvimbo:80u ”Mini,Matte tin alloy yakapfachukira.
Pasi pendiro:30u” min,Nickel.
Shell:30u” Min,Nickel yakazara yakazara
Solder nzvimbo: Gole flash.
Solder nzvimbo: Gole flash.
Zvemagetsi:
Chiyero chezvino: 0.5A
Kutsigira Voltage: AC500V rms
Insulation Resistance: 1000MΩMin, At DC 500V
Bata Kupikisa: 100mΩ Max.
Making Cycles:3000 Insertions.
Kushanda Tembiricha: -45ºC ~+85ºC
